| 摘要 |
PURPOSE:To prevent a melted glass sealing material from flowing outside by coating the cavity of a ceramic substrate to which a semiconductor element is secured with a cover of ceramic formed for the sealing material inside a projection to seal the substrate. CONSTITUTION:A semiconductor element 2 is secured to the bottom of the cavity of a ceramic substrate 1, wired with fine metal wirings 3, coated with a ceramic cover 4, and the substrate 1 and the cover 4 are hermetically sealed with a glass sealing material 5 therebetween. A projection 4a having, for example, 0.2mm of height is formed along the peripheral edge of a lower surface, and the material 5 having, for example, 0.3mm of thickness is formed higher than the projection 4a along the inside of the projection 4a. The substrate 1 is coated with the cover 4, the material 5 is melted, and the periphery of the cavity of the substrate 1 and the cover 4 are sealed therebetween. The glass sealing surface is not externally flown from the substrate 1 and the outside of the cover 4 at this time. |
