发明名称 |
SOLID-STATE IMAGE PICKUP ELEMENT |
摘要 |
PURPOSE:To delete the process for assembling and the number of parts by integrating an optical fiber flux with a sealing plate. CONSTITUTION:One of the optical transmission surface of the optical fiber flux 1 is bonded to an image pickup surface of a solid-state image pickup element 3 by a transmission resin 2 including an optical setting resin and a part of the optical fiber flux 1 and the package 4 of the solid-state image pickup element are bonded. For instance, the optical fiber flux is horizontally spread in a flange shape. In this manner, the sealing plate is not required and on the sealing, the flange part of the optical fiber flux 1 and the image pickup element package 4 may be simply air tightly bonded by a sealing resin 5. Thereby, the sealing plate is not required but the process for sealing can be deleted.
|
申请公布号 |
JPS62179281(A) |
申请公布日期 |
1987.08.06 |
申请号 |
JP19860021439 |
申请日期 |
1986.02.03 |
申请人 |
MATSUSHITA ELECTRONICS CORP |
发明人 |
HIRAMOTO MASAO;OKUBO YOSHIO |
分类号 |
H01L23/02;H01L27/14;H04N5/225;H04N5/335 |
主分类号 |
H01L23/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|