发明名称 SOLID-STATE IMAGE PICKUP ELEMENT
摘要 PURPOSE:To delete the process for assembling and the number of parts by integrating an optical fiber flux with a sealing plate. CONSTITUTION:One of the optical transmission surface of the optical fiber flux 1 is bonded to an image pickup surface of a solid-state image pickup element 3 by a transmission resin 2 including an optical setting resin and a part of the optical fiber flux 1 and the package 4 of the solid-state image pickup element are bonded. For instance, the optical fiber flux is horizontally spread in a flange shape. In this manner, the sealing plate is not required and on the sealing, the flange part of the optical fiber flux 1 and the image pickup element package 4 may be simply air tightly bonded by a sealing resin 5. Thereby, the sealing plate is not required but the process for sealing can be deleted.
申请公布号 JPS62179281(A) 申请公布日期 1987.08.06
申请号 JP19860021439 申请日期 1986.02.03
申请人 MATSUSHITA ELECTRONICS CORP 发明人 HIRAMOTO MASAO;OKUBO YOSHIO
分类号 H01L23/02;H01L27/14;H04N5/225;H04N5/335 主分类号 H01L23/02
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