| 摘要 |
A method of fabricating multi-level interconnect systems comprising metal contact portions (42, 10) with polyimide insulating layers (12) sandwiched therebetween involving spinning a polyimide filling layer over apertures formed in the polyimide insulating layer so that polyimide fillets (40) accumulate in any cracks in the bases of the apertures before metal contact portion (42) is provided. <IMAGE> |
