| 摘要 |
PURPOSE:To simplify the composition of a dispersion plating liq. and to facilitate the control of the composition as well as to reduce the cost of materials by adding ammonium chloride at a specified concn. to the plating liq. prepd. by suspending a dispersible material in a nickel sulfamate soln. as a base without adding nickel chloride used generally in the plating liq. CONSTITUTION:Ammonium chloride is added by 5-50g/l, preferably 20-40g/l to a dispersion plating liq. prepd. by suspending a dispersible material such as hard and fine SiC particles in a nickel sulfamate soln. as a base without adding nickel chloride used generally in the plating liq. A plated film of an Ni-P alloy contg. dispersed SiC formed with the resulting dispersion plating liq. has a strong matrix, the hardness of the plated film is increased and the control of the composition of the plating liq. is facilitated.
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