| 摘要 |
A method of repairing an electrical conductor path interruption on a printed circuit board in the presence of heat sensitive electrical components is disclosed. The area proximate the electrical conductor path interruption is cleaned to electrically expose the conductor and area proximate the electrical interruption and to remove any dielectric material thereat which would interfere with electrical conductivity. A mask is applied to the surface of the printed circuit board parallel to the electrical conductor path and on each side of the electrical interruption adjacent the cleaned area to provide a channel which includes the electrical interruption along a portion of the electrical conductor path. At least one coat of an electrically conductive paint is applied within and along the channel to conductively connect the electrical conductor path interruption. The applied electrically conductive paint is allowed to harden. The conductive paint connection is then tested to insure electrical continuity along the involved paths. The mask is removed from the surface of the printed circuit board and at least one sealer coat is applied to the area proximate the applied electrically conductive paint to seal and protect the electrically conductive paint and the area proximate the conductive paint, thereby reestablishing the electrical conductor path.
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