| 摘要 |
PURPOSE:To improve the reliability of bonding with a wiring for a substrate of an outer lead by positioning a bonding section to one opening of a through- hole in a member and injecting a sealing resin from the other opening of the through-hole. CONSTITUTION:A through-hole 5 is bored to a member 4. A section where an inner lead 2a is bonded with a chip part 1 is positioned to one opening of the through-hole 5. A sealing resin 6 such as epoxy is injected from the other opening, the member 4 side, of the through-hole 5. The resin 6 fills the through-hole 5, and seals the bonding section. Consequently, an outflow to the outer lead 2b side of the resin 6 is prevented. Accordingly, the reliability of bonding with a wiring for a substrate of the lead 2b is improved.
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