发明名称 Automated assembly system for semiconductor device
摘要 To automatic assembly of a semiconductor device, a robot having 6 degrees of freedom is provided for effecting conveyance among prior automated devices. The robot includes a readout means for reading an identification number of a magazine for housing lead frames therein for identifying each magazine. The robot also includes a sampling station for quality control within the working range thereof. The robot includes a control means for storing magazines drawn out for quality control. Accordingly, no disturbance is produced in article flows among the component devices. The system further includes an inputting means for inputting a lot number of lead frames within the magazines. Thus, lots are reliably controlled because of one-to-one correspondence between the lot number and the identification number of the magazine.
申请公布号 US4683644(A) 申请公布日期 1987.08.04
申请号 US19850754960 申请日期 1985.07.15
申请人 OKI ELECTRIC INDUSTRY CO., LTD. 发明人 TANGE, KOHSUKE;TAKAHASHI, OSAMU;FURUYA, YUHKI;HARADA, AKIRA
分类号 H01L21/50;H01L21/00;(IPC1-7):H01L21/58;H01L21/60;B23P21/00 主分类号 H01L21/50
代理机构 代理人
主权项
地址