| 摘要 |
PURPOSE:To reduce an interference between circuits in an IC chip due to external connection leads in an IC package by forming the connecting portion of internal connection leads to branch it to at least two corresponding to the number of the internal leads. CONSTITUTION:The end of an external connection lead F is branched to two portions, which are connected with internal connection leads W1, W2 connected with bonding pads B1, B2 disposed on the surface of an IC chip, bonded on die pads D. The other ends of the leads are exposed out of the package of an IC to form a ground terminals, and connected with ground wirings on a printed substrate at the final using stage. Then, an interference between circuits in the IC chip due to the external connection lead F in the IC package can be reduced. |
