| 摘要 |
PURPOSE:To ensure the state of pressure welding between a semiconductor pellet and an electrode at all times, and to improve the reliability of a semiconductor device by adding a function transmitting pushing force generated by a spring element over a pressure-welded electrode more positively. CONSTITUTION:An electrode 2 is pressure-welded to a semiconductor pellet 1 by a plurality of spring elements 3 incorporated to a semiconductor device. Consequently, even when the peripheral sections of the spring elements 3 are displaced mutually, pushing force is transmitted positively over the electrode 2 because pushing force is transmitted through an annular plate 9, thus preventing the damage of the state of pressure welding between the pellet 1 and the electrode 2. Accordingly, the reliability of the semiconductor device is improved.
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