发明名称 MEASURING METHOD FOR GAP BETWEEN DIE MATCHING FACES
摘要 PURPOSE:To grasp the gap size between dies at optional positions quantitatively by interposing metal which is easy to deform plastically between the matching faces of the dies and measuring the thickness after the metal deforms after pressure application by die clamping. CONSTITUTION:A recessed part 11 which is bored in a chaise block 2 almost to the plate thickness of a lead frame. Plural metallic pieces 12 which are easy to deform plastically are arranged in the recessed part 11 of a bottom die as shown in figure (a). Then, die clamping pressure is applied as shown in figure (b) to cause the metallic pieces 13 to deform plastically. The thickness of the metallic piece 13 after the deformation is measured to grasp the gap size between the top and bottom dies quantitatively by using the previously measured side before the deformation. Those metallic pieces 12 are arranged at optional positions, so the size of each position is measured. The total quantity of deformation by the press die clamping pressure of a platen in a room temperature state and deformation by die clamping pressure, the quantity of deformation by each die pressure value of the press, etc., are grasped by this measurement.
申请公布号 JPS62177401(A) 申请公布日期 1987.08.04
申请号 JP19860019643 申请日期 1986.01.31
申请人 MITSUBISHI ELECTRIC CORP 发明人 TAKAHASHI TATSURO
分类号 H01L21/56;B29C33/20;B29C45/02;B29C45/14;B29C45/70;G01B5/14 主分类号 H01L21/56
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