| 摘要 |
PURPOSE:To provide the titled composition containing hydrophobic silica as thixotropy-affording agent, giving marked thixotropy, outstanding is thickening ability, capable of enhancing reliability and mass productivity in the bonding of electric material-related parts such as chip bonding in the IC industry. CONSTITUTION:The objective composition constituted by (A) the first liquid made up of (i) (meth)acrylic oligomer and/or (meth)acrylic monomer [e.g. 2- hydroxyethyl (meth)acrylate], (ii) photopolymerization initiator (e.g., benzil, 2-chlorothioxanthone), (iii) polymerization initiator consisting of peroxyester (e.g. tert-butylperoxybenzoate) and (iv) thixotropy-affording agent consisting or hydrophobic silica (e.g. prepared by treating silica surface with hexyltrimethoxysilane) and (B) the second liquid made up of (V) the component (iii) mentioned above and (vi) accelerator consisting of a compound capable of forming redox system (e.g. aldehyde-amine condensate).
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