发明名称 SHAPE OF PAD IN SEMICONDUCTOR INTEGRATED CIRCUIT
摘要 PURPOSE:To reduce the effects to other parts such as an output driver and the like, to prevent erroneous operation and to enhance the stabilization of a system, without separating and increasing pads, by providing a slit in a power supplying pad, and dividing one power source pad into two or more parts. CONSTITUTION:With a contact part made to remain, an aluminum layer 1 at a pad part is divided with a slit 2. The contact part 3 is made to remain so that operation can be recognized even if a needle is contacted to either of the divided pads when evaluation is performed with a probe card. Connection is performed with a bonding ball 4. The effects of potential fluctuation and the like to a pad part 6 from a pad part 5 are reduced because the signal passes through a bonding resistance. The stability of a system can be enhanced without separating and increasing the pads. When the power supplying pad is divided into three parts with the slits, the same effect can be obtained as in the case of the pad is divided into two parts.
申请公布号 JPS62176140(A) 申请公布日期 1987.08.01
申请号 JP19860018669 申请日期 1986.01.30
申请人 SEIKO EPSON CORP 发明人 ONO YOSHITERU
分类号 H01L21/60 主分类号 H01L21/60
代理机构 代理人
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