发明名称 STRUCTURE FOR HEAT TRANSFER WALL
摘要 PURPOSE:To obtain the heat transfer wall of high thermal conductivity without spoiling the light weight property of a matrix by a method wherein a porous diaphragm, formed with a multitude of through holes from the inner surface to the outer surface of the matrix, is formed with heat flow paths from one surface to the other surface of the matrix through the holes by heat conductive bodies. CONSTITUTION:A porous tube 10 is formed with a multitude of through holes 12 from the inner surface to the outer surface of a matrix 11. These holes 12 are filled with metallic particles (Cu) 16 and these conductive bodies 17, consisting of the metallic particles 16, are provided in the matrix 11 along the direction of the thickness of the porous tube 10 to form the flow path of heat. Contribution for the improvement of thermal conductivity is increased in proportional substantially to the volumetric content of the conductive bodies 17. A very high thermal conductivity may be obtained compared with the case of conductive fillers so far, which are dispersed and blended into the matrix, and, further, the content is small, therefore, light weight property, possessed by the matrix 11 itself, will never be spoiled.
申请公布号 JPS62175587(A) 申请公布日期 1987.08.01
申请号 JP19860016931 申请日期 1986.01.30
申请人 KOMATSU LTD 发明人 HARAGA HISATO
分类号 F28F1/00;B32B1/08;B32B3/24;B32B7/02;C23C18/16;C23C18/31;C23C18/40;F28F13/00 主分类号 F28F1/00
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