发明名称 COMPRESSION BONDED TYPE SEMICONDUCTOR DEVICE
摘要 PURPOSE:To prevent eccentricity and position deviation between a guided-out electrode and a semiconductor element and to provide an improved position-fixing structure with respect to the semiconductor element, by the structure, wherein the semiconductor element is positioned by a hard member, the center of an axis is fixed, and the rotation of the semiconductor element around the center of the axis is prevented by an elastic member. CONSTITUTION:In the Figure, a numeral 17 indicates a positioning member, which is an annular plate body, at the outer peripheral part of which a tubular side wall 17a is provided, and is made of a hard insulating material. The inner diameter of the tubular side wall 17a is equal to the outer diameter of a circular heat buffer plate 5a. The inner diameter of a hole in the annular plate body is equal to the outer diameter of a guide-out electrode 3a on an anode side. Said hard member 17 is coupled to the heat buffer plate 5a and the guide-out electrode 3a on the anode side by way of a spacer 18 as shown in the Figure. A semiconductor element 4 is positioned with the hard member 17. The rotation of the disk shaped semiconductor element must be prevented. Therefore, an annular elastic member 19 is coupled between the outer surface of the heat buffer plate 5a and the inner wall of a tubular insulator 1 of a package. Thus the rotation is blocked.
申请公布号 JPS62176137(A) 申请公布日期 1987.08.01
申请号 JP19860016854 申请日期 1986.01.30
申请人 TOSHIBA CORP 发明人 MATSUDA HIDEO;TSUNODA YOSHIAKI;KUBOTA TAKASHI
分类号 H01L21/52;H01L21/58 主分类号 H01L21/52
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