发明名称 SPUTTERING TARGET
摘要 PURPOSE:To improve the yield of a target by forming only the parts of the target undergoing practical erosion with a material to be sputtered and the remaining part with a harmless material. CONSTITUTION:A sputtering target is used for sputtering by which ion beams are irradiated on a solid sample to sputter part of the surface of the sample in vacuum. The parts of the target undergoing practical erosion by sputtering are formed with a prescribed material 12 to be sputtered and the remaining part 13 is formed with a material which causes no problem even when sputtered.
申请公布号 JPS62174372(A) 申请公布日期 1987.07.31
申请号 JP19860013885 申请日期 1986.01.27
申请人 SHINKU YAKIN KK 发明人 TAKAHASHI KAZUHISA
分类号 C23C14/34;C23C14/46 主分类号 C23C14/34
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