| 摘要 |
<p>PURPOSE:To cut down significantly the material cost of parts to be used for the title device and to simplify remarkedly the assemble process by forming the device into a construction wherein a metal frame sealed with a light-transmitting window is buried in a plastic mold. CONSTITUTION:The parts of a metal frame 7 consisting of a 42-alloy or copal and sealed with a light-transmitting window 5 consisting of a borosilicate glass or a sintered body of alumina (Al2O3) is prepared. A semiconductor chip 4 of an EPROM is welded on a die stage 8 of a lead frame 3 and the chip and inner leads of the lead frame are connected to each other with bonding wires 6. Then, the metal frame sealed with the light-transmitting window is dipped in a hollow part 9 (In the diagram, the hollow part in after being filled with the solution of a UV-transmitting resin 10 is shown.) filled with the solution of a UV-tranmsitting resin 10 facing the window surface downward and the lead frame 3 finished the bonding process with the chip is fixed by pressure to the metal frame 7 in the direction that the lead frame portion on the chip side is dipped in the resin solution. As organic insulating tapes 11 are ready-adhered on the lead frame, the lead frame and the metal frame are fixed. After that, the whole surface of the metal frame is buried in a plastic mold 13 using assemblies except the light-transmitting window 5 and outer leads 12.</p> |
