| 摘要 |
PURPOSE:To improve the heat sink effect of a diode bridge rectifier by forming the portion of a lead frame for placing and connecting a diode element in a thick structure, and exposing the back surface of the lead frame to be used also as a heat sink plate. CONSTITUTION:A lead frame 2 continuously punched and formed from a metal plate is formed of thick portions 2A, 2B for placing diode elements 1A-1D, and connecting terminals 2C-2F bent and connected with the thick portions. The elements 1A-1D are placed on the portions 2A, 2B, and further connected by aluminum bonding wirings 3A-3D with connecting terminals 2D, 2E. After a diode bridge circuit is formed in this manner, it is molded with an insulating material. The back surface of the molded substrate is exposed at the back surfaces of the portions 2A, 2B so that the exposed surfaces are formed in the same plane as the back surface of the substrate 4. |
