| 摘要 |
PURPOSE:To reduce the cost of a hybrid IC product by forming all of wiring patterns and external-lead wiring sections of aluminum coatings and using aluminum small-gage wires for wire bonding. CONSTITUTION:A lead frame 20 consists of a plurality of external leads 20b composed of an iron nickel alloy and a plate-shaped IC mount 20a surrounded by the leads 20b and supported by a specific number of the leads 20b. A ceramic layer 21 is formed onto the surface of the mount 20a, and an aluminum-wiring pattern 23 on which various chips are arranged and wired is shaped onto the surface of the ceramic layer 21. Aluminum coatings 24 are formed to wiring connecting sections for the leads 20b. Aluminum small-gage wires 27 are used for wire bonding. Accordingly, the cost of the products of hybrid ICs is reduced. |
