| 摘要 |
PURPOSE:To obtain a semiconductor device having no possibility of internal shortcircuit but having high reliability and many pins by using a laminated lead frame in which a plurality of lead frames are laminated through an insulating sheet. CONSTITUTION:A laminated lead frame F in which a first layer lead frame 3 and a second layer lead frame 4 are laminated through an insulating sheet member 5 is bonded by an insulating bonding member 5 to a base substrate 2. A pellet 8 is bonded to the pellet placing portion 2a of the substrate 2, and a pellet electrode 8a and the leads 3a of the frame 3 and the leads 4a of the frame 4 are connected by metal fine wirings 7. Then, the wirings 7 for connecting the leads 3a, 4a with the electrode 8a are wired in parallel with other adjacent leads 3a, 4a so that both have no possibility of shortcircuits. Thus, a semiconductor device having high reliability and many pins can be obtained. |
