发明名称 CERAMIC SUBSTRATE FOR SEMICONDUCTOR DEVICE
摘要 PURPOSE:To improve glass sealing properties by forming a metallic coating layer consisting of Al or an Al alloy to the surface of a section to be sealed with glass in a nonoxide group ceramic substrate. CONSTITUTION:A metallic coating layer 10 composed of Al or an Al alloy is shaped to the surface of a section to be sealed with glass in a nonoxide group ceramic substrate 9. A lead frame 5 is fixed onto the coating layer 10 by low melting-point glass 4. Glass components diffuse and permeate into Al or the Al alloy at that time, thus resulting in firm adhesion. Consequently, thermal strain based on the difference of the thermal expansion coefficients of the glass 4 and the substrate 9 is relaxed. Accordingly, glass sealing properties are improved.
申请公布号 JPS62173743(A) 申请公布日期 1987.07.30
申请号 JP19860016199 申请日期 1986.01.28
申请人 SUMITOMO ELECTRIC IND LTD 发明人 MAEDA TAKAO;KANEHIRO KAZUO;IGARASHI TADASHI
分类号 H01L23/15;H01L23/08;H01L23/10 主分类号 H01L23/15
代理机构 代理人
主权项
地址