| 摘要 |
PURPOSE:To contrive to enhance humidity resistance of an electronic circuit by limiting penetration of humidity only to space between sealing resin and a substrate plate or pads by a method wherein the outer periphery edge of the sealing resin sealing a semiconductor element is made not to be put on a solder resist. CONSTITUTION:An electronic circuit mounting construction is so constructed to make a solder resist 3 as not to be covered with the sealing resin 8 of a semiconductor element 6. For that purpose, the semiconductor element 6 is fixed to the center of a bonding part 1 whose periphery is surrounded with a solder resist 3, the pads 7 of circuits 5 are connected mutually by wires, and when the parts thereof are to be covered with the sealing resin 8, the outer periphery edge of the sealing resin 8 is made as to be ended inside of the inner periphery part of the solder resist 3 interposing an interval between them. To attain this way, it is favorable to form the parts of the pads 7 protruding from the solder resist 3 to the inner periphery side to be a little largish. |
