IMPROVED HEAT-RESISTANT POLYIMIDE FILM

摘要

PURPOSE:A polyimide film, obtained by adding fine inorganic powder to a polyimide, forming fine protrusions on the surface, molding the resultant blend and subjecting the molded film to corona discharge and having remarkably and stably improved adhesive and running properties and well bondable to copper foils. CONSTITUTION:A polyimide film obtained by adding fine inorganic powder to a polyimide, forming fine protrusions on the surface, molding the resultant blend and subjecting the molded film to corona discharge. Fine inorganic powder selected from SiO2, TiO2, CaHPO4 and Ca2P2O7 is used as the fine inorganic powder. The corona discharge is carried out at an output within the range of 20-500W.min/m<2>. The particle diameter of the inorganic powder to be used is <=100mum, preferably 1-5mum.