| 摘要 |
PURPOSE:To make it unnecessary to provide bending parts to lead terminals and to enlarge the sidewall parts of a vessel, and to enable formation of the vessel small in size in an electronic parts such as an organic positive temperature coefficient thermistor by a method wherein connection between the element main body and lead terminals is constructed according to cut and raised parts of the lead terminals. CONSTITUTION:The top and under vessel parts 2a, 2b of a vessel 2 are integrally molded respectively with flat board type lead terminals 3a, 3b, both the edges of the flat board parts 6a, 6b of both the lead terminals 3a, 3b are buried in the side walls of the vessel parts 2a, 2b, and outside terminal parts 5a, 5b are protruded outside penetrating the side walls on one side of the vessel parts 2a, 2b. Electric contact between electrodes 1a, 1b formed on the top and under surfaces of an element main body 1 and the lead terminals 3a, 3b is attained by elastic contact between cut and raised parts 4a, 4b protruding toward the upper and lower directions from the neighborhood of the central parts of the flat board parts 6a, 6b of the lead terminals and both the electrodes 1a, 1b.
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