| 摘要 |
PURPOSE:The titled inexpensive paste suitable for forming an electrically- conductive film on boards for forming electronic circuit, having high reliability, containing a specific binder such as a phenolic resin, etc., silver powder consisting essentially of thin piece powder and a specific solvent such as butyl Cellosolve acetate, etc. CONSTITUTION:The aimed paste consisting of a (modified) phenolic resin and/or (modified) xylene resin as a thermosetting resin, (B) silver powder (preferably comprising fine particles with <=80 meshes, having >=50wt% thin piece powder) mainly comprising thin piece powder and (C) butyl Cellosolve acetate, butyl Carbitol acetate and/or isophorone as a solvent. In a blending ratio, 100pts.wt. component B is blended with 3-100pts.wt. component A and 5-60pts.wt. component C. The thin piece silver powder, for example, is produced by treating silver nitrate with an ankali to give silver oxide, reducing the silver oxide with formaldehyde to produce granular silver powder and mechanically processing the powder into thin pieces.
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