| 摘要 |
PURPOSE:To stabilize quality by a method wherein a laser beam is projected on regions surrounding a semiconductor plastic package aboard a lead frame under transfer for the incineration of burrs and pressurized water is sprayed onto said regions for the removal of tailings and unnecessary coatings. CONSTITUTION:Plastic burrs 3 in existence along the circumference of a semiconductor plastic package 2 aboard a lead frame 1 transported into a laser processing chamber 4 are incinerated in a laser beam 6. It occasionally happens, in this process, that three remain in the vicinity of the semiconductor plastic package 2 tailings of the burrs 3 after incineration or thin films attributable to incinerated impurities. Such tailings and films are peeled off and removed by pressurized water 16 sprayed onto the affected regions in a pressurized water process chamber 13. Accordingly, burrs are completely removed from a package without causing any damage to the package, which results in a product equipped with a stable quality and high reliability.
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