发明名称 |
Segmented heat sink device |
摘要 |
A segmented heat sink device is provided for application to integrated circuit packages for heat dissipation purposes. The segmented heat sink device involves four duplicate sectors, each of which has a patterned set of radial fin elements through which cooling air flow may run. The reduction of the base length of each segment provides for reduction in expansion/contraction stress due to the heating and cooling cycles involved.
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申请公布号 |
US4682651(A) |
申请公布日期 |
1987.07.28 |
申请号 |
US19860904442 |
申请日期 |
1986.09.08 |
申请人 |
BURROUGHS CORPORATION (NOW UNISYS CORPORATION) |
发明人 |
GABUZDA, PAUL G. |
分类号 |
H01L23/367;(IPC1-7):F28F7/00 |
主分类号 |
H01L23/367 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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