| 摘要 |
<p>PURPOSE:To reduce the cost of IC mounting and improve the reliability of IC mounting and realize extremely fine pitch of IC mounting by a method wherein conductive adhesive is applied to at least some parts of a circuit pattern by electrodeposition and the parts of the circuit pattern and the electrode lead- out terminals of an IC are joined and electrically in contact with each other with the conductive adhesive in between. CONSTITUTION:The positions of the electrodes lead-out terminal parts 5 of an IC 4 are aligned with the positions of a circuit pattern 2 to which conductive adhesive 3 is applied by electrodeposition and, by holding the conductive adhesive 3 between the IC 4 and a circuit board 1 and pressing or heating the adhesive 3 from both sides, the IC 4 is electrically connected to the circuit board 1 and at the same time fixed to it. If necessary, fixing strength of the IC may be further improved by fixing the circumference of the IC by non-conductive adhesive. As it is not necessary to make the copper foil pattern 2 hang over the substrate of the circuit board 1 at the IC mounting part, the number of manufacturing processes of the circuit board can be reduced by the elimination of the overhanging.</p> |
