| 摘要 |
<p>Method of producing multilayer circuit boards, a fixed layered structure produced by this method, and the use of this layered structure in this production method. In this method for the production of multilayer circuit boards the layered structure comprising laminates and prepregs is already joined together, before the curing operation, with the aid of mechanical connection means in such a manner that the laminates are fixed relative to one another, preferably with a material-to-material connection. The layered structure itself is thus characterized in that it is joined together with the aid of mechanical connection elements (5) in such a manner that the laminates (1, Z) are fixed relative to one another by the connection elements (5).</p> |
