| 摘要 |
PURPOSE:To facilitate inspection with high speed and high accuracy by a method wherein 1st circuit which realizes the function of an integrated circuit and 2nd circuits with which the 1st circuit is inspected are manufactured together in 1st process and the circuit part in the 1st and 2nd circuits which passes the inspection is cut off and the 1st circuit is taken out as the final product in 2nd process. CONSTITUTION:An LSI 1, which is the unit of design, manufacture and inspection in the first stage, is constituted by a circuit part 21 which realizes the essential function of an LSI and becomes an LSI as the final product and a testing circuit 3 which is composed of a pattern generating circuit part 31 and a pattern observing circuit part 32 and serves as the circuit for inspecting the circuit part 21 on a wafer. Then the self-inspection of the LSI is carried out with the testing circuits 31 and 32 and, if the inspection is satisfactory, the wafer is cut along a cut line 22 to obtain an LSI 2 as the final product.
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