发明名称 |
Method for forming deposited film |
摘要 |
A method of forming a deposited film comprises forming a gaseous atmosphere of at least one silicon compound selected from those having the formula (A), (B) or (C) as shown below in a deposition chamber in which a substrate is arranged, and exciting and decomposing said compound by utilization of light energy thereby to form a desired film containing silicon atoms on said substrate: <IMAGE> (A) wherein l represents 3, 4 or 5; and R represents H or SiH3; <IMAGE> (B) wherein R1 and R2 independently represent H or an alkyl group having 1 to 3 carbon atoms; m an integer of 3 to 7; and n an integer of 1 to 11; R1-(SixR2R3)p-R4 (c) wherein R1 and R4 independently represent a phenyl or naphthyl group which may be substituted with halogens, or an alkyl group having 1 to 11 carbon atoms; R2 and R3 independently represent H or CH3; and p represents an integer of 3 to 7.
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申请公布号 |
US4683145(A) |
申请公布日期 |
1987.07.28 |
申请号 |
US19850722134 |
申请日期 |
1985.04.11 |
申请人 |
CANON KABUSHIKI KAISHA |
发明人 |
NISHIMURA, YUKUO;EGUCHI, KEN;MATSUDA, HIROSHI;HARUTA, MASAHIRO;HIRAI, YUTAKA;NAKAGIRI, TAKASHI |
分类号 |
B05D3/06;B05D7/24;C23C16/22;C23C16/48;H01L21/205;(IPC1-7):B05D3/06 |
主分类号 |
B05D3/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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