发明名称 |
Method for electroplating non-metallic surfaces |
摘要 |
Method for electroplating non-metallic surfaces on a substrate, e.g. of plating holes in metal clad laminates, is disclosed. Metallic sites are formed on the surface and the resulting site-containing surface is electroplated by means of an electroplating bath comprising a component which causes the plating to preferentially occur at said sites in comparison to the plating on surfaces of the same metal as the one plated out; whereby a rate differential of the plating-reaction on site-surfaces is achieved with respect to the plating-reaction on a surface consisting of the metal to be plated out.
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申请公布号 |
US4683036(A) |
申请公布日期 |
1987.07.28 |
申请号 |
US19850800360 |
申请日期 |
1985.11.21 |
申请人 |
KOLLMORGEN TECHNOLOGIES CORPORATION |
发明人 |
MORRISSEY, DENIS M.;TAKACH, PETER E.;ZEBLISKY, RUDOLPH J. |
分类号 |
C25D5/54;H05K3/42;(IPC1-7):C25D5/54 |
主分类号 |
C25D5/54 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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