| 摘要 |
<p>PURPOSE:To manufacture a semiconductor device, which has excellent damp- proof reliability and hardly fouls a mold, by sealing the semiconductor device with a multifunctional epoxy compound, amine salt with a dimethylpolysiloxane skeleton and/or a resin composition containing a piperazine group. CONSTITUTION:A bifunctional epoxy compound such as diglycydyl ether of bisphenol A or a trifunctional or more of epoxy compound such as triglycydyl ether of para-amino phenol is used as the multifunctional epoxy compound. Dimethylpolysiloxane tetramethyl amine salt is available as amine salt having a dimethylpolysiloxane skeleton or an oligomer having a piperazine group. It is preferable that the amine salt having the dimethylpolysiloxane skeleton or the oligomer having the piperazine group is employed within a range of 0.1-20wt% to the multifunctional epoxy compound.</p> |
