| 摘要 |
PURPOSE:To provide a highly reliable method of mounting a semiconductor chip by a method wherein outer leads of a lead frame, whose inner leads are bent so as to have a moderate spring effect, are bonded to circuit patterns on a substrate and the inner leads of the lead frame are connected to solder bump electrodes of the semiconductor chip which is die-bonded on the substrate by reflow soldering. CONSTITUTION:A semiconductor chip 6 is die-bonded on the die-pad 9 of a substrate 7. Outer leads 11b are bonded to circuit patterns 8. At that time, as inner leads 11c are subjected to bending process, the tips of the inner leads 11c are pressed against respective solder bump electrodes 10. By subjecting the solder bump electrodes 10 to reflow soldering at this stage, the inner leads 11c and the solder bump electrodes 10 are connected.
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