| 摘要 |
PURPOSE:To execute plating with excellent brightness, surface smoothness and adhesiveness on the surface of a polyamide resin molding by etching the surface of said molding then subjecting the surface to catalyzing treatment then activating the surface under specific conditions using an acid and sodium hydroxide. CONSTITUTION:The surface of the polyamide resin molding is etched in an etching and post etching stage using a hydrochloric acid and thereafter the surface is catalyzed by using an aq. soln. contg. palladium ions and tin ions. The surface is then subjected to an accelerator treatment using an acid such as sulfuric acid and is further treated for 2-8min at 20-45 deg.C by using an aq. soln. of 10-30g/l NaOH; thereafter the molding is subjected to warm washing for 3-12min at 50-100 deg.C or is treated for 3-10min at 50-80 deg.C by using an aq. soln. of 20-60g/l NaOH and is then washed, by which the post accelerator treatment is executed. The surface is subjected to chemical plating then to electroplating after the activation of the above-mentioned catalyst, by which the plating is executed on the above-mentioned polyamide resin molding. |
