发明名称 IC LOADING DEVICE
摘要 PURPOSE:To improve the work efficiency by adsorbing an IC in which many sliding bodies having a sucker have been inserted through a rail and have been made to contact closely, and subsequently, expanding and opening a prescribed clearance, and separating the adjacent ICs by its clearance portion. CONSTITUTION:Many sliding bodies 30 having an adsorbing body 31 which has provided continuously a sucker 32 on the lower end are inserted through a rail 29 of a loading device 7 and connected. In this case, the sliding bodies are set so as to be positioned adjacently and separately by a prescribed clearance size portion through a built-in cylinder. The loading device 7 is moved to the upper part of a holder stationary device 21 through an air cylinder, also, a gap of each sliding body 30 being in an adjacent position is expanded and opened, and a gap of each IC which has been adsorbed by the sucker 32 is separated by the clearance portion. In this way, a soldering work of the IC having a terminal in four peripheral side edges can be automated. Accordingly, the work efficiency is improved.
申请公布号 JPS62168667(A) 申请公布日期 1987.07.24
申请号 JP19860008339 申请日期 1986.01.18
申请人 TAKAKI SEISAKUSHO KK 发明人 HASHIMOTO SHINICHI;KAWAMURA SHIYUNGO
分类号 H01L23/50;B23K1/08;H01L23/48;H05K13/04 主分类号 H01L23/50
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