| 摘要 |
The present invention concerns the mounting of two semiconductor components within a single or common housing. When two semiconductor components are always connected according to the same wiring diagram one presents them within a single housing in which their intrinsic connection has already been achieved. When one of the two components is produced from small-sized semiconductor chip the invention proposes replacing this first semiconductor chip by a wholly mounted component. Thereby it allows first of all to verify the integrity of this component and to dispose, furthermore, of an element whose dimensions now allow easy handling. This component is thus utilized in its finished state to replace one of the connections bridges of the electrodes of the second component to a pin of the housing in which this component must be installed. That means that in the manufacturing process of the second component, nothing is changed. |
