发明名称 INSPECTING METHOD FOR BONDING SURFACE PARALLELISM OF TAB BONDER
摘要 PURPOSE:To eliminate the uncertainly and to reduce the number of inspecting steps by placing a parallelism inspecting plate on which a thin aluminum film is deposited on a flat glass plate on a stage, inspecting the parallelism by a TAB bonding tool, pressurizing and heating, checking the pressurized portion of the plate, and inspecting the parallelism of the bonding surface. CONSTITUTION:A TAB bonder is formed of a TAB bonder stage 1 and a TAB bonding tool 5, and a parallelism inspecting plate 9 placed on the stage 1 is formed by depositing aluminum 9b on a glass plate 9a in the thickness of approx. 1mum. To inspect the parallelism by using the plate 9, the plate 9 placed on the stage 1 is pressurized by the tool 5, and heated at 400 deg.C for approx. 3sec. At this time, the aluminum 10 is softened by heating the tool 5, and since the thickness of the aluminum film is approx. 1mum, only the portion pressurized by the pressure of the tool 5 is recessed at 1mum or less.
申请公布号 JPS62166535(A) 申请公布日期 1987.07.23
申请号 JP19860007989 申请日期 1986.01.20
申请人 OKI ELECTRIC IND CO LTD 发明人 OKADA TAKASHI;KIMURA MASARU;TAKAHASHI HIROMI;SHIBATA ISAO
分类号 H01L21/66;H01L21/60 主分类号 H01L21/66
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