发明名称 PROCESSING CUP FOR SEMICONDUCTOR MANUFACTURING APPARATUS
摘要 PURPOSE:To simplify a piping and to simplify a piping work by opening a fluid passing hole in the thicknesswise direction of a bottom plate to form a connecting hole rising substantially perpendicularly in a boss, opening a nozzle port for injecting fluid at the upper end, and forming a connecting port of a fluid piping system at the outside end of the passing hole. CONSTITUTION:A piping system 19 is connected by utilizing a joint 18 with the connecting port 17 of a through hole 13 at the outer peripheral end of a bottom plate 1. Fluid such as cleanser or gas is supplied as by an arrow C from a fluid supply source provided in the system 19. The fluid advances in the hole 13 as designated by an arrow D, and arrives at a groove 14 cut on the outer peripheral surface of a boss 5. Here, the fluid is split in both directions as designated by arrows with broken lines to advance in the circumferential groove 14. When the fluid is fed to a connecting hole 15, the fluid rises in the hole 15 in a direction of an arrow E. Thereafter, the fluid is injected from a nozzle port 15 connected with the hole 15 in a direction of an arrow F, sprayed on the back surface of a work 2 held in a spin chuck 3 to clean the work 2 and dry it.
申请公布号 JPS62166515(A) 申请公布日期 1987.07.23
申请号 JP19860008029 申请日期 1986.01.20
申请人 HITACHI ELECTRONICS ENG CO LTD 发明人 UMENO RYUTARO
分类号 H01L21/306;G03F7/16;H01L21/027;H01L21/30;H01L21/304 主分类号 H01L21/306
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