发明名称 TAPE CARRIER SYSTEM IC
摘要 PURPOSE:To facilitate handling by fixing a radiator plate with a columnar fixing section to the back of an IC connected to a tape carrier by a good thermal conductor and covering an IC circuit with the end surface of the fixing section. CONSTITUTION:An IC 3 is connected to a tape carrier through leads 2, and a radiator plate 4, four corners thereof have columnar fixing sections 41, is bonded with the back of the IC 3 with silver-filled epoxy adhesives 6. The radiator plate 4 and the IC 3 are positioned precisely by using perforations for the tape carrier 1. The IC 3 is detached from the tape carrier 1, and bonded and fixed to a substrate 7 by the fixing sections 41, downward directing a circuit surface. The leads 2 are thermocompression-bonded with signal pads, and a cooling plate 9 is fast stuck to the radiator plate 4. According to the constitution, handling is facilitated because the radiator plate 4 is gripped on the mounting of the IC, thus also ensuring a positioning with the substrate, then acquiring the mounting substrate having a high reliability.
申请公布号 JPS62165941(A) 申请公布日期 1987.07.22
申请号 JP19860007210 申请日期 1986.01.18
申请人 NEC CORP 发明人 HATAKEYAMA ATSUSHI
分类号 H01L21/60 主分类号 H01L21/60
代理机构 代理人
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