发明名称 Photosensitive resin composition.
摘要 <p>Disclosed herein is a photosensitive resin composition composed mainly of an alkali-soluble organometallic polymer and a photosensitive dissolution inhibitor. The composition is used as a positive type resist which can be developed with an alkali developing solution. The resist has high sensitivity, high resolution, and resistance to oxygen plasma.</p>
申请公布号 EP0229629(A2) 申请公布日期 1987.07.22
申请号 EP19870100100 申请日期 1987.01.07
申请人 HITACHI, LTD. 发明人 SUGIYAMA, HISASHI;NATE, KAZUO;INOUE, TAKASHI;MIZUSHIMA, AKIKO
分类号 G03C1/675;G03C1/72;G03C1/00;G03F7/022;G03F7/039;G03F7/075;G03F7/11;G03F7/26;H01L21/027;(IPC1-7):G03F7/10 主分类号 G03C1/675
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