REFLOW BONDING OF ELECTRONIC OR ELECTRICAL PARTS,申请号GB19870000597-传众专利搜索

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发明名称	REFLOW BONDING OF ELECTRONIC OR ELECTRICAL PARTS
摘要
申请公布号	GB2185432(A)	申请公布日期	1987.07.22
申请号	GB19870000597	申请日期	1987.01.12
申请人	* FUJITSU LIMITED	发明人	YOSHIO * ISOGAI
分类号	B23K3/04;B23K3/047;H05K3/34;H05K13/04;(IPC1-7):B23K1/12	主分类号	B23K3/04
代理机构		代理人
主权项
地址

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