| 摘要 |
PURPOSE:To eliminate the pinholes generating by adhesion of splash of a processing solution by a method wherein a flow-rate controlled processing solution runs from the nozzle on the first stage in the state wherein it is formed in a sticklike form, and said processing solution covers the surface of the photoresist on a wafer instantaneously. CONSTITUTION:A flow-rate controlled processing solution 9 coming from the first stage nozzle 20 is poured on the wafer 3 by a flow-rate controlling valve 22. At that time, the nozzle 20 on the first stage is formed in the shape in such a manner that the processing solution 9 will not be scattered, it will run out in a collected form, and that it will instantaneously cover the surface of the wafer 3. Then, following the first stage of nozzle 20, the shower nozzle 8 on the second stage is provided and besides, the shower nozzle 8 and 8 on the final stage are provided leaving an interval. Said shower nozzles 8 make the processing solution 9 into a laterally spreading fanlike formed shower 9a, thereby enabling to be sprinkled on the moving wafer 3. |
