发明名称 |
Semiconductor device including leadless packages and a base plate for mounting the leadless packages |
摘要 |
A semiconductor device includes a plurality of leadless packages and a base plate for mounting the leadless packages. The leadless packages include a semiconductor chip housed therein and a plurality of electrodes formed on the surface thereof. The base plate has conductor patterns formed on both of two main surfaces thereof, and the electrodes of each leadless package are soldered to the conductor patterns. The base plate also has a plurality of lead pins which project from one edge thereof in parallel with the main surface.
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申请公布号 |
US4682207(A) |
申请公布日期 |
1987.07.21 |
申请号 |
US19860915851 |
申请日期 |
1986.10.03 |
申请人 |
FUJITSU LIMITED |
发明人 |
AKASAKI, HIDEHIKO;TSUJIMURA, TAKEHISA |
分类号 |
H01L23/50;G11C5/00;H01L23/498;H01L25/10;H05K1/14;H05K1/18;H05K3/34;H05K3/36;H05K3/40;(IPC1-7):H01L23/32 |
主分类号 |
H01L23/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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