| 摘要 |
PURPOSE:To ensure stable internal connection and sealing by a method wherein a plurality of metal films isolated from each other and formed along the circumference of an island serve as relay points for bonding wires. CONSTITUTION:A lead frame 1 is provided, approximately at the center of its island 2, with a first metal film 4a for mounting a semiconductor element 5 and second metal films 4b, isolated from each other by an insulating film 8, positioned along the circumference of the island 2. For the production of the lead frame 1, Au layers are formed, one at the center of the island 2 of the lead frame 1 as a first metal film 4a for mounting a silicon chip and others at inner lead ends 3 as third metal films 4c. Next, along the circumference of the island 2, an Al2O3 layer is formed in a ring from to serve as an insulating film 8. On the Al2O3 layer, at the locations corresponding to semiconductor element electrodes and inner lead ends 3, Al layers are partially formed to serve as the second metal films 4b for the completion of a lead frame of this design. |
