| 摘要 |
PURPOSE:To eliminate the need for the direct contacts of a probe with electrode pads for each semiconductor chip, and to reduce the movement of the probe while preventing damage by contacts with the probe by utilizing a scribing region in a semiconductor substrate and forming signal lines for testing the semiconductor chips. CONSTITUTION:Interdisciplines 3 for semiconductor chips 2a, 2b... are shaped as scribing regions for dividing a semiconductor substrate 1 having a large diameter into each semiconductor chip 2a, 2b.... Al wirings 41, 42... common with the semiconductor chips belonging to the same lines or adjacent lines are formed in said scribing regions 3, and connected to electrode pads contained in respective semiconductor chip and for tests. The signal line 41 applying a power supply VCC, the signal line 42 applying ground potential and the signal line 43 for inputting and outputting test signals are shaped in common. Enable signal lines 6a, 6b, 6c... independently lead out of each semiconductor chip 2a, 2b and for selecting the chips are formed in addition to the common signals 41, 42, 43 in the scribing region 3.
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