| 摘要 |
PURPOSE:To heat a pellet and lead sides respectively up to the optimum temperatures while making a pellet heating part and a lead heating part respectively out of materials with different heat conductivity by a method wherein the heat conductive part of heating parts heating a semiconductor pellet and leads is removably fixed to a heat block. CONSTITUTION:A lead frame provided with a tab 2A loaded with a semiconductor pellet 1 of a wire bonding device as well as a multitude of outer leads 2 is mounted on a pertinent holder 3. The lead frame is heated from backside by a heat block 4 to join the pellet 1 to the leads 2 heated at a suitable temperature with wires 5 using a bonding head 6. The heat conductive part of a block 4 is composed of a pellet heating part 7 and a lead heating part 8 respectively made of materials with different heat conductivity. In such a constitution, the surface temperatures on respective heat conductive surfaces are provided with specified difference to heat the pellet 1 and the leads 2 up to the optimum values by a single heat block 4. |
