| 摘要 |
PURPOSE:To obtain a lead frame characterized by no breakdown of leads, excellent vibration resisting property and no loss in mass productivity, by forming the bent part of a specified lead among a plurality of leads at the outside of a resin molded body. CONSTITUTION:A lead frame 21 has the following parts: a bed part 23, to which a semiconductor pellet for one semiconductor device is fixed; three leads 24, one part of which is embedded in a resin molded body 22 after molding, and the other parts of which are extended only from one side of the resin molded body 22; and a strip shaped lead linking frame 25, which links the outer end parts of three leads so that the leads are aligned in one line as shown in the Figure. Of the three leads, a bent part 27 is provided in the central lead (collector lead) at the outside of the resin molded body. When a distance W between the central lead and the leads at both ends is made long, vibration resisting property is remarkably improved. |
