METHOD FOR PLATING STAINLESS STEEL WITH COPPER

摘要

PURPOSE:To obtain a homogeneous copper film having high adhesive strength by chemically plating the surface of stainless steel with copper after baking the steel in an oxidizing atmosphere. CONSTITUTION:Stainless steel is baked at 250-550 deg.C, especially 300-450 deg.C in an oxidizing atmosphere for 5-180min, especially 10-60min to form a ferric oxide- base oxidized film. The surface of the baked steel is chemically plated with copper. It is preferable that the surface of the baked stainless steel is activated with an aqueous palladium chloride soln. before carrying out the chemical copper plating.