| 摘要 |
PURPOSE:To obtain the constitution of a bonding pad having high bonding strength by providing a stress relaxation layer under the bonding pad. CONSTITUTION:A stress relaxation layer 4 consisting of a tenacious organic substance is formed on a ceramic substrate 1 coated with a glazed glass 2. Laser a writing 3 and bonding layers 5-1, 5-2 are formed. When the stress relaxation layer is formed in 10mum thickness using polyimido resin, it has been confirmed that the strength of a bonded section is 2-3 times higher than when no stress relaxation layer is provided. |
