| 摘要 |
<p>An electrically variable three terminal monomorphic piezoelectric capacitor is manufactured with thick or thin film hybrid microelectronic circuit technology. A first capacitor plate (12) and a ridge (16), which substantially surrounds and extends above the first capacitor plate, are formed on the surface of a substrate (10). A monomorphic piezoelectric wafer (20) having a control plate (24) and a second capacitor plate (22) on opposing surfaces is bonded to the upper surface of the ridge (16). During bonding, a force (26) is applied at the center of the wafer (20) which fixes a permanent bow in the wafer in the direction of the first capacitor plate (12). A four terminal monomorphic embodiment, and three and four terminal bimorphic embodiments are also described.</p> |
